WaferTrac / MicroTrac
M O D U L E S
'[ Spinner Module ] [ Coat Module ] [ Developer Module ] [ Hotplate Module ] [ Indexers ]
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Microtrac Systems are production proven automated wafer processing systems for 75mm to 150mm diameter wafers. Founded
in the original Wafertrac 1006 product line (left), Microtrac is a reduced footprint version of the Wafertrac 1006 system using the same high performance wafer processing
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Standard Features
- PC based system architecture
- Operator friendly graphics interface
- Advanced system controller displays real time readout of spin speed, oven temperature, system messages and module status.
- Supports SEMI equipment communications standard (SECS).
- On or Off line diagnostics
- Statistical data maintained on a per batch basis.
- Work in Process (WIP) monitoring for all wafers
- Computer controlled wafer transport.
- Audible and visual alarms
- Capacitive wafer sensing
- Reliable air bearing wafer transport with 0.05µ point of use filtration for gentle wafer handling…no moving parts to generate particles.
- Teflon coated hard anodized track plates.
- Stainless steel panels.
- Class 10 operation, particulate control maintained at less than 0.03 particles per cm2 0.03µ or larger.
Spinner Module
- 254 program steps, 0.1 second increments, 25.4 sec maximum time per program step.
- Spin speed range 50-7500 RPM in 10 RPM increments.
- Control to set point ± 2 RPM
- 200 to 30,000/50,000 RPM programmable acceleration (150mm/100mm)
- Acceleration increment 200 RPM per second
Coat Module
- Compatible with most pump manufacturers
- Backside edgebead removal
- Bottle drains with pneumatic release
Optional System Features- Coat Module
- Order up to 3 dispense nozzles (stationary).
- Spinner agitation module.
- Movable (dual) nozzle with predispense capability
- Topside edgebead removal system
- Low maintenance cup.
- Direct chemical drain.
- Teflon chemical protection package.
- Progressive Technologies exhaust controller
Developer Module
- Pressurized spray dispense with 15 liter canister
- Self-cleaning dual dispense nozzle assembly for develop and DI rinse.
- Puddle and dynamic spray dispense tips
- Backside rinse system
- DI topside flood rinse
- Direct developer waste drain
Optional System Features- Developer Module
- Up to one additional dual nozzle assembly.
- Advanced temperature control unit- temperature range 10ºC - 30ºC, temperature control +0.5ºC at nozzle.
- Coaxial fluid delivery to the nozzle.
- Lechler® ultrasonic nozzles
- Teflon® chemical protection package.
- Spinner preventative maintenance kit.
Square Hotplate Bake Module
- Soft bake, hard bake, dehydration bake, post-exposure bake, cascadable.
- Temperature programmable 45º - 365ºC in 1º increments.
- Temperature uniformity ±1ºC up to 150ºC, ±1% from 151º - 250ºC, ±2%, 251º - 365ºC.
- Bake time 1 - 2816 seconds, 1 second increments.
- Cool plate programmable 1 - 255 seconds as function of bake temperature.
- Air bearing transport and centering… no moving parts and no edge contact.
Indexers
- Send, receive, pass through or buffer modes.
- Fluoroware compatible.
- Capacitive wafer sensors.
- 3/16" or 1/4" pitch
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